গ্লাস কাটার ডেস্ক

Lisec GFB+VB+BHK 60/30

Combi line - float and laminated glass cutting
Long live upgrade 2022:

Console
Keybord
Touchscreen
Windows 10

Combi cutting line float + laminated glass consisting of:

1 x S-CUT-1408 Lisec GFB 60-30S-RE with low-E grinder shape cutting jumbo 3300 x 6000 mm
1 x S-CUT-1409 Lisec VB 33 laminated cutting bridge cut 3300 mm max from 3300 x 6000 glass
1 x S-CUT-1410 Lisec BHK 60-30 breakout and unloading or reverse loding table

2022:
MODIFICATION-SERVICE
PC-Upgrade from I-PC 2004 (WinXP) to I-PC 2018 (Win10 LTSC)
new 18" touch display
new keyboard
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new control terminal MBF-372
new monitor bracket

SOFTWARE UPDATE
Upgrade GPS.hand 5.38 to LIS.hand
The Upgrade includes the following modules:
-Lis.hand Basis
-NC Code Converter
-Quickopt Add on
HASP dongle
remote installation

Update GPS.mon 6.53 ESL to the latest Release (covered by the mc)

The GFB+VB+BHK 60/30 refers to a high-performance automatic glass cutting and breakout line manufactured by LiSEC. This system is designed for high-capacity industrial glass processing, handling large formats (jumbo sheets) of both float and laminated glass.
System Components
The alphanumeric code describes the specific machinery units integrated into the line:
GFB 60-30 (Glasschneidetisch für Floatglas): A high-speed, CNC-controlled glass cutting table for float glass. The "60-30" indicates its capacity for jumbo sheets, typically up to 6,000 x 3,300 mm.
VB 33 (Verbundglasschneidbrücke): A specialized cutting bridge for laminated glass. It typically includes tools for scoring the top/bottom glass layers and heating/cutting the PVB interlayer.
BHK 60-30 (Brech- und Hilfskipptisch): A breakout and unloading table. It facilitates the controlled snapping of glass sheets along the scored lines and serves as the exit point for the finished pieces.
Key Technical Specifications
Maximum Sheet Size: 3,300 mm x 6,000 mm (Jumbo size).
Glass Thickness: Typically handles float glass from 2 mm to 19 mm.
Advanced Features: Newer or reconditioned models often include Low-E grinding for edge deletion, shape-cutting scanners, and Windows-based control systems for optimization.